Envara, Inc. Adopts IBM Silicon Germanium Process for Dual Band Wireless LAN RF Chip

Select a topic or year

PALO ALTO, CA - 24 Apr 2002: ...Envara Inc., one of Israel's leading RF and wireless networking companies, with offices here, today announced that it is using IBM's silicon germanium (SiGe) process to develop a low-cost dual band full radio transceiver chip for its WiND dual-mode WLAN wireless chipset.

The WiND dual-mode 2.4 and 5GHz chipset includes an integrated MAC-Baseband processor chip with dual IEEE 802.11 a+b modem function and a low-cost RF chip with integrated dual band 2.4 and 5GHz implementation, that supports the 802.11a,b and g standards.

Envara has chosen to implement its WLAN radio chip using IBM's SiGe technology because of the advantages IBM's process brings to RF design. These include: