IBM Extends Capabilities Of HyperBGA(TM) Organic Chip Packaging

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EAST FISHKILL, NY - 16 Jul 2002: IBM today announced enhancements to its HyperBGA(TM) organic chip packaging technology, designed to meet requirements of high-end information systems and communications applications.

HyperBGA(TM) packages are now available in sizes up to 52.5mm. The package can accomodate chip die sizes up to 18.3mm, with higher I/O counts and additional split voltage planes beyond the current offerings, supporting the higher levels of function and performance increasingly required in these applications.

IBM has qualified this new HyperBGA(TM) packaging for its own semiconductor roadmap and plans to offer the technology as an option for a number of its standard and custom semiconductor products.

"This technology is designed to meet customer needs for higher bandwidth and increased function," said Hal Lasky, direct of Interconnect Products, IBM Microelectronics. "We understand the requirements of complex designs and we'll continue to introduce a variety of packaging technologies and services to help customers optimize their systems."

The new HyperBGA(TM) package has been stressed to full field conditions, passing 3600 cycle and 0-100 ATC testing required for high field life. By testing the module with a heat sink and assembled to a card, additional customer testing is minimized, thereby helping reduce customer costs and time-to-market. A comprehensive range of services, including physical design and modelling, is available to further assist the customer in mapping the design to their particular application.

On July 1, 2002, IBM and Endicott Interconnect Technologies (EIT) announced an initial agreement under which EIT will take over IBM Microelectronics HyperBGA(TM) operations. Upon closure of the agreement, IBM plans to continue to purchase the technology from EIT and offer it as an option for some of its semiconductor products. All further development, manufacturing and marketing of HyperBGA(TM) as a standalone chip packaging product line will be under the direction of EIT.