IBM, Chartered, Samsung Produce Advanced Mobile Technology for QUALCOMM

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EAST FISHKILL, N.Y., SINGAPORE and SEOUL, SOUTH KOREA - 26 Oct 2006: Common Platform technology founding members IBM, Chartered Semiconductor Manufacturing and Samsung Electronics Co., Ltd. today announced that they have successfully produced 90-nanometer (nm) chips for QUALCOMM Incorporated in their respective 300mm fabs.

Working with QUALCOMM, the Common Platform members have manufactured in volume leading-edge, low-power system-on-chip (SoC) products that support mobile telecommunications technologies. The QUALCOMM chips are being used in cellular phone chipsets and other devices to enable wireless communications worldwide. The Common Platform relationship with QUALCOMM extends past 90nm, to 65nm and beyond

The Common Platform is a game-changing business model jointly developed by IBM, Chartered and Samsung to enable synchronized manufacturing across 300mm fabrication facilities at 90nm, 65nm and 45nm process technologies. Using this new approach, a single design can be multi-sourced to any of the three facilities, making it possible to produce nearly identical chips from any one of several manufacturing facilities around the globe. Because Common Platform technology allows "multi-sourcing," clients are not tied to a single vendor, but rather have unprecedented flexibility and choice.

'Potential to transform the industry'

"As semiconductor real estate becomes more densely populated, the designs become exponentially more complex," said Dan Olds, principal, Gabriel Consulting. "The cost to redesign a chip so that it can be manufactured using a different process is considerable. The Common Platform has the potential to transform the industry by accelerating innovation and lowering costs for foundries, solution providers and customers."

The Common Platform, a commitment to collaborative innovation and openness, is gaining traction in the semiconductor industry. Essentially, the initiative signals that IBM, Chartered and Samsung have formally aligned their manufacturing facilities to create a one-team environment for maximum client value.

"Collaborative innovation means the sharing of intellectual capital as well as physical capital, of people as well as dollars," said Ana Molnar Hunter, vice president of technology for Samsung Semiconductor, Inc. "Accelerated learning and yield ramps lead to cost benefits for both customers and partners. The Common Platform works because all parties benefit by getting products to market faster at reduced cost."

In other news, ARM announced that it has been selected by the Common Platform to provide libraries for 45nm process technology. Libraries are the building blocks that help customers design and manufacture advanced semiconductor technology. 

NOTE TO EDITORS:  B-roll of IBM executives discussing today’s announcement as well as a photo of IBM’s 300mm East Fishkill, NY fab are available at the bottom of this page.

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QUALCOMM SELECTS IBM, CHARTERED, SAMSUNG CHIP PARTNERSHIP -- IBM's state-of-the-art 300mm chip plant in East Fishkill, N.Y., is one of three such sites selected by QUALCOMM to produce chips for its wireless communications products. IBM, Chartered and Samsung are founders of a unique 'Common Platform' collaboration that allows QUALCOMM the flexibility to manufacture nearly identical chips at any one of three separate facilities around the world.


IBM Executives discuss today's announcement.

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