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Overview
IBM’s newest core offerings are based upon the PowerPC 460 embedded core technology and capable of supporting cache coherent multiprocessor designs. The PowerPC 460 core is a 32-bit high performance, low-power embedded processor core which is fully compliant with the flexible and scalable Power ISA™ 2.03. Offered in both synthesizable and hard core forms the new processor core offerings provide higher performance and greater design flexibility to meet specific SoC needs.

The licensable embedded cores integrate a superscalar seven-stage pipeline, with support for two instructions per clock, separate instruction and data caches, a JTAG port, trace FIFO, multiple timers and a memory management unit (MMU), with 2.0 DMIPS/MHz performance.

PowerPC 460S synthesizable core
As a synthesizable core the 460S provides the flexibility of fabrication in multiple foundries. The 460S core allows the SoC designer to select the size cache and Processor Local Bus (PLB) version necessary to optimize single processor and cache coherent multi-processor SoC designs. The 460S design flexibility and scalability will meet the performance and power demands of today’s communications, consumer electronics and storage embedded applications.

The 460S contains a dual-issue, superscalar, pipelined processing unit. The core includes memory management, cache control, timers and debug facilities. Interfaces for custom co-processors and floating point functions are provided, along with separate instruction and data cache array interfaces which can be configured to various sizes.


Example 460S Configuration

PowerPC 464-H90 hard core
Implemented in IBM’s advanced Cu-08 copper technology, the IBM PowerPC 464-H90 is a 32-bit high performance, low-power embedded processor core which is fully compliant with the flexible and scalable Power ISA™ 2.03.

The PowerPC 464-H90 core contains a dual-issue, superscalar, seven stage pipelined processing unit designed to provide 1.0GHz (worst case performance) and 2000 DMIPs performance. Additional functions include memory management, cache control, timers and debug facilities. The processor local bus (PLB) it is fully compatible with the IBM CoreConnect on-chip system architecture, providing the framework to efficiently support system-on-chip (SoC) designs.

The PowerPC 464 H90 core’s performance, power specifications and design attributes make it an ideal solution for emerging wired communications, consumer, storage and embedded computing applications.


Example 464-H90 Configuration

464-H90 parametric table
  IBM 90nm, 5LM
DMIPS — worst case*
DMIPS — nominal
1732 @ 866MHz @ 1.1V
2200 @ 1.1GHz @ 1.2V
CPU/L1 Power — typical 0.53mW/MHz @ 1.1V
Core Size 5.5mm²

Note: Refer to the Core Support Manual for performance data across multiple voltage and temperature conditions.


PowerPC 464FP-H90 hard core
Implemented in IBM’s advanced Cu-08 copper technology, the IBM PowerPC 464FP-H90 is a 32-bit high performance, low-power embedded processor core with integrated double precision floating point unit. The PowerPC 464FP-H90 is fully compliant with the flexible and scalable Power ISA™ 2.03.

The PowerPC 464FP-H90 core contains a dual-issue, superscalar, seven stage pipelined processing unit designed to provide 1.0GHz (worst case performance) and 2000 DMIPs performance. Additional functions include memory management, cache control, timers and debug facilities. The processor local bus (PLB) is fully compatible with the IBM CoreConnect on-chip system architecture, providing the framework to efficiently support system -on-chip (SoC) designs.

The PowerPC 464FP-H90 core’s performance, power specifications and design attributes make it an ideal solution for emerging wired communications, consumer, storage and embedded computing applications.


Example 464FP-H90 Configuration


464FP H90 parametric table
  IBM 90nm, 5LM
DMIPS — worst case*
DMIPS — nominal
1666 @ 833MHz @ 1.1V
2132 @ 1066GHz @ 1.2V
CPU/L1 Power — typical TBD
Core Size 6.43mm²

Note: Refer to the Core Support Manual for performance data across multiple voltage and temperature conditions.






 
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