Getting the most from a semiconductor design today means finding inventive ways to maximize performance beyond silicon scaling alone. The right packaging solution matters more than ever.
IBM offers a comprehensive portfolio of leading-edge package assembly and test services optimized to deliver differentiation in high-complexity package solutions for semiconductor original equipment manufacturers (OEMs).
Situated in the high-tech corridor of northeast North America, IBM facilities in Bromont, Canada, Burlington, VT, and East Fishkill, NY provide a complete, advanced flip-chip assembly solution, from wafer bumping through final module test. These services are available for both IBM and non-IBM customer wafers, and are complemented by laminate design, test and burn-in development support, packaging application support and state-of-the-art lab services.
With extensive experience in bringing both complex and high-volume packaging solutions to the marketplace, the IBM assembly and test services offerings are designed to help customers quickly ramp sophisticated solutions to production volumes. Ongoing collaborative work at the MiQro Innovation Collaboration Centre (C2MI), located just a few steps away from IBM assembly and test operations in Bromont, enables customers to benefit from advances and innovation in packaging and test development for next-generation semiconductors.
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