Join IBM experts at the VLSI Technology & Circuits Symposia

Technologists and researchers from IBM will share insights on semiconductor advancements and how the advances are enabling next-generation devices at the 2013 Symposia on VLSI Technology and Circuits. Hear IBM experts discuss SOC versus 3D IC and Novel Hierarchy in Emerging Memory at panel sessions and present papers on Fully Depleted Technologies and Scaling Challenges of Packaging and other topics, including FinFET on oxide, interconnects, TCAM, device layout and technology R&D advances.

The VLSI Symposia will be held June 11-14, 2013 in Kyoto, Japan. For more information, go to:

See the listing that follows for a full listing of IBM’s presence at the event.

Panel sessions:

Invited papers:

Technology papers:

Circuit papers:

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