IBM is offering a full front-to-back process design kit (PDK) for its 180 nm silicon-on-insulator (SOI) specialty foundry technology, 7RF SOI, developed for use with Agilent Technologies’ Advanced Design System (ADS) EDA software. The new PDK enables designers to achieve high confidence in the non-linear behavior of today's most complex RF front-end module (FEM) circuits in mobile devices.
The evolution of wireless standards for mobile devices, including LTE and 802.11ac Wi-Fi, is driving unprecedented FEM complexity and demands exceptional linearity and low insertion loss. IBM 7RF SOI technology is uniquely tuned to address these demands and designers can now exploit these characteristics of 7RF SOI within the ADS environment.
IBM is demonstrating its commitment to the leading edge of FEM development by continuously broadening its technology and enablement portfolio for 7RF SOI to provide customers with ever increasing flexibility to address the challenges of complex FEMs. With more than 3 billion 7RF SOI chips already deployed in mobile devices, industry leaders are choosing this technology to cut costs and reduce area by designing integrated, single-chip RF solutions.
“Our customers require dedicated RF design flow support to handle the challenges of today's sophisticated RF designs,” said Ned Cahoon, specialty foundry business development executive at IBM. “By collaborating with Agilent, we have extended our PDK support for the ADS environment. Customers can now use Agilent’s ADS platform to design mobile-optimized chips in IBM 7RF SOI. For customers already familiar with ADS, this can mean even faster time to market."
“Our common customers can now use this kit to enjoy full back-end support that includes schematic-driven layout creation, layout-versus-schematic check and integrated 3D planar electromagnetic and 3D-FEM simulators,” said Juergen Hartung, RFIC marketing and foundry program manager of Agilent EEsof EDA. “These capabilities are just some of the reasons why more and more RFIC designers choose ADS to increase performance, consistency and yield.”
Detailed specifications for IBM 7RFSOI technology can be found in the IBM 7RF SOI product brief (759KB).
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