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Collaborating on a global scale

How IBM engineers are collaborating with clients, business partners, ISV's and education institutions across the globe

  

Each week, IBM will highlight a story from around the world where IBM engineers are collaborating with clients, business partners, ISV's and education institutions to bring the latest technology to the market in new and innovative ways.


Did you know...

...that IBM and austriamicrosystems will jointly develop a high-voltage (HV) complementary metal oxide semiconductor (CMOS) process technology to be used in a range of consumer, automotive, industrial and medical applications? This collaborative effort couples austriamicrosystems' HV experience with IBM's proven leadership in analog and radio frequency, and will establish the new benchmark in the power CMOS marketplace, enabling devices that require higher analog performance and faster time to market.

As consumer demand for enhanced mobile phones, portable devices with color screens and camera functions increases, so does the market for chips that use less power and offer better performance. In fact, industry experts forecast the market for customized power management ICs in mobile devices to almost triple in size to $3.4 billion by 2010.  *

Production is scheduled to begin in 2009 at IBM's 200mm manufacturing facility in Essex Junction, Vermont. You can see the press release here.

See how IBM is collaborating with clients in unique ways in next Friday's installment of 40 Clients in 40 Weeks.

 * From Gartner Dataquest, "Forecast: Customized Power Management ICs for Mobile Handsets, Worldwide, 2005-2010," Steve Ohr and Masatsune Yamaji, Table 2.


 
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