News and events

IBM Offers High Performance Computing Outside the Lab (press release)
New BladeCenter QS22 Delivers Supercomputing Power for Everything From Financial Trading to Oil-Field Discovery

EE Times fetes ACE Award Winners at ESC: IBM wins "Innovator of the Year" Awards (press release)
ACE winners included Dan Edelstein and Satya Nitta, of IBM Research, for "Innovator(s) of the Year."

IBM-Led Chip Alliance Delivers Major Semiconductor Performance Leap, Power Savings Using Innovative "High-K/Metal Gate" Material (press release)
IBM and its joint development partners – Chartered Semiconductor Manufacturing Ltd. (Chartered), Freescale Inc., Infineon Technologies AG, Samsung Electronics Co., Ltd. (Samsung), STMicroelectronics N.V. and Toshiba Corporation – today announced that they have collectively demonstrated significant performance and power consumption advantages over industry standards by using a breakthrough material known as "high-k/metal gate” (HKMG) on silicon manufactured at IBM's state-of-art 300 millimeter (mm) semiconductor fabrication facility in East Fishkill, N.Y. With this achievement the joint development partners are now ready for early customer engagements. Clients may now design in this leading edge, low power foundry technology in order to help speed time-to-market and help realize power-performance advantage for their products.

AMCC Expands the Reach of Power Architecture 4xx Product Portfolio through Enhanced Relationship with IBM Microelectronics (AMCC press release)
IBM will incorporate the AMCC Power Architecture 4xx processor product portfolio into IBM's Semiconductor solutions offering, effective immediately.

IBM Pioneers Process to Turn Waste Into Solar Energy (press release)

IBM and MediaTek to Bring Wireless High Definition TV and Movies to Consumers (press release)

New IBM Technology Enables Single-Chip Mobile Solutions (press release)
Semiconductor technology to reduce complexity, provide cost savings for mobile device component manufacturers.

IBM Power Architecture Heads to Unexplored Region of Mars (press release)
NASA Phoenix Mars Lander with power-based processors will seek conditions favorable to life.

IBM Delivers Chip Technology Innovations to Market (press release)
Introducing Cu-45HP, the first ever ASIC with SOI technology, CMOS 11LP, IBM's low power 45 nm CMOS Foundry technology optimized for mobile devices, SiGe BiCMOS 5PAe, the first IBM product based on through-silicon via technology and SiGe BiCMOS 6WL, a cost optimized technology for mobile phones, WLAN and global positioning devices.

Common Platform™ Technology alliance extends support to 45nm (press release)

First ever Power Developers conference to be held (press release)
Conference to provide in-depth technical training and demonstrations.

IBM unveils world’s fastest on-chip dynamic memory technology (press release)
Breakthrough system-on-a-chip design speeds multi-core, graphics, and networking performance while reducing energy.

IBM announces first of its kind Cell Broadband Engine contest for students (press release)
From inspiration to innovation, with cash prizes for winners.

IBM advancement to spawn new generation of chips (press release)
First fundamental change to basic transistor in forty years.

IBM and Freescale announce landmark technology development agreement (press release)
Companies to collaborate on future semiconductor technologies.