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 Manufacturing
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IBM can keep pace with your demand as your business grows. Prototyping and low-volume production are available at IBM's award-winning 200 mm and 300 mm fabrication facilities. You can also leverage the Common Platform technology collaboration to help meet your high-volume production needs.
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200 mm fab in Burlington, VT
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300 mm fab in East Fishkill, NY
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The IBM Multi-project Wafer program is designed to help small, innovative organizations design and prototype high-performance chips at a lower cost. The program offers advanced IBM semiconductor technology to chip designers who might not typically have an opportunity to work with IBM.
Many chip designs do not move from "the lab to the fab" because the limited quantities involved make it economically impractical to manufacture the chips. Aggregating designs onto a single wafer can help minimize the cost of fabricating prototype quantities. The aggregation enables multiple clients to share production overhead costs.
MOSIS, an IBM Business Partner, provides cost-efficient prototyping and low-volume production manufacturing services for IBM CMOS, RF CMOS, silicon-germanium BiCMOS and CMOS image sensor process technologies. The current MPW schedule is available from MOSIS.
HKSTP (Hong Kong Science and Technology Park) is a new IBM Business Partner working with clients worldwide, with initial focus on the China/Asia market.
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