Custom logic

ASIC design systems for a connected world.

As the communications infrastructure evolves—think 4G LTE rollouts, heterogeneous networks, mounting volumes of data traffic—semiconductor solutions must include more on-chip storage. Faster packet processing. More memory operations per second. IBM embedded memory solutions are specifically designed to deliver superior performance, power-efficiency and reliability for performance-driven, system-on-a-chip (SoC) applications:

  • High-performance, trench-based embedded DRAM offerings enable the integration of more than one gigabit of memory into a single chip for sophisticated SoC solutions and offer significantly lower soft error rates than embedded SRAM, while consuming less power and taking up less space on a chip.
  • Ternary CAMs (TCAMs) can help accelerate lookups in high speed routers, switches and other networking hardware. IBM Cu-32 (PDF, 903KB) features one of the industry’s fastest TCAM offerings.
  • An algorithmic multiport (AMP) memory compiler, available in Cu-32, can be used to create a broad range of memory configurations that improve on the memory-operations-per-second of the underlying memories used to build them. The AMP memory structures are multi-ported memories that are lower power and higher density compared to conventional, physical multi-ported memories, which carry the power and area overhead of additional circuits.

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  • IBM Cu-32 (903KB)

    One of the industry’s fastest TCAMs. 28G SERDES. Learn more about IBM’s 32 nm, HKMG custom logic offering.

  • IBM Cu-45 (209KB)

    Read more about IBM’s pioneering 45 nm, SOI-based custom logic offering.

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