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IBM custom logic solutions are helping to empower the rapidly evolving network infrastructure with the ability to keep up with escalating demands driven by the growing number of interconnected devices. A comprehensive portfolio of IBM silicon-on-insulator (SOI) and CMOS design platforms is designed to help boost performance and optimize power across a range of networking, storage and other performance-driven applications.

Differentiate with high-performance embedded DRAM (eDRAM), high-speed SERDES (HSS) and PowerPC offerings from IBM or design-in intellectual property available from the IBM network of third-party suppliers. This broad range of differentiation options enables you to implement proven IP, from industry leaders, to tailor and optimize your semiconductor design.

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The IBM design methodology, featuring statistical timing, can help simplify the integration of these design elements for even the most demanding designs. A holistic design flow is designed to help you achieve first-pass design success, and has helped industry leaders bring some of the world's most complex and dense semiconductor chips to the marketplace.

To help take performance and power advantages to new levels, exploit IBM SOI-based design platforms. IBM experience with SOI spans seven generations of the technology, and the company has shipped more than 100 million SOI semiconductor chips. IBM SOI custom logic offerings build on this expertise to offer significant performance, power and soft error rate advantages compared with semiconductor chips manufactured in bulk CMOS technology.

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Smarter silicon for wireless communications

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IBM Microelectronics technology for smarter communications

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