Billions of devices, connecting billions of people and things worldwide. It’s clear that how we communicate has changed dramatically. Mobile devices are everywhere. And it’s no secret that mobile and wired network infrastructures have to adapt and evolve to keep up.
IBM semiconductor technologies are playing a major role in enabling smarter communications, offering application-optimized solutions for hardware spanning the communications infrastructure: in the cloud, the network and in M2M endpoints and mobile devices.
As the leading supplier of ASICs for wired communications, IBM custom logic offerings are designed to deliver performance and power-efficiency in sophisticated semiconductor chips and SoCs for network and data center hardware, from routers, switches and radio access network equipment to network storage solutions. Backed by expert support, robust design methodology and flexible engagement models, IBM custom logic solutions include:
- High-performance memory offerings, including algorithmic multiport memories and embedded TCAM, DRAM and SRAM, designed to help speed packet processing and searches
- High-speed SERDES (HSS) cores optimized to enable faster data transmission across the network
Mobile takes center stage in any conversation about communications today. IBM is a major supplier of foundry technologies for WLAN applications and a marketplace leader in the SiGe technology that chip suppliers are deploying in customers solutions to relieve network bottlenecks.
The IBM specialty foundry portfolio draws on more than 25 years of expertise to offer unique, cost-efficient technologies for the wireless infrastructure, mobile devices and M2M endpoints. IBM foundry technologies are enhanced by comprehensive design enablement and end-to-end support, and include:
- High-performance SiGe technologies specifically geared for cellular base station and wireless backhaul solutions; advanced optical transport; and other performance-driven RF applications
- RF SOI, SiGe and RF CMOS technologies optimized for transceiver, RF switch, power amplifier and integrated front-end applications in mobile devices
- HV CMOS technologies tuned for high voltage and power management solutions, including smarter endpoint applications for building automation and renewable energy
Solutions from third party suppliers complement IBM offerings. Take advantage of low-power digital technologies, vertically optimized design platforms, collaborative Linux development for mobile applications and other design enablement, EDA and intellectual property offerings available through the extended IBM ecosystem.
Contact IBM
- Let an IBM sales representative
answer your question or find an
authorized distributor. - Contact us
Browse IBM Microelectronics
Featured videos
Smarter communications (00:02:49)
See how IBM semiconductor offerings are enabling smarter communications.
Smarter silicon for wireless communications (00:03:36)
Explore application-optimized IBM semiconductor technologies for the mobile revolution.
IBM Microelectronics (00:03:44)
Discover where and how IBM silicon is being used in the Internet of things.
Literature
- IBM Cu-32(533KB)
One of the industry’s fastest TCAMs. 28G SERDES. Learn more about IBM’s 32 nm, HKMG custom logic offering.
- IBM Cu-45(208KB)
Read more about IBM’s pioneering 45 nm, SOI-based custom logic offering.
- IBM Specialty Foundry Selection Guide (PDF, 160KB)
Key specifications and supported tools for IBM specialty foundry offerings.
- IBM SiGe BiCMOS 8HP(907KB)
Performance-optimized silicon to handle the most demanding RF applications.
- IBM SiGe BiCMOS 5PAe(177KB)
Advanced through-silicon via technology for RF power amplifier applications.
- IBM 7RF SOI(692KB)
Affordable, integrated, analog front-end solutions just got one step closer.
- IBM CMOS 7HV(858KB)
High-voltage power management technology in a cost-effective, 180 nm CMOS base.