IBM specialty foundry technologies are powering a new generation of mobile devices and smarter products. Choose from a comprehensive portfolio of analog mixed-signal (AMS) offerings that includes advanced high-voltage CMOS (HV CMOS), integrated passive device (IPD), RF CMOS, RF SOI and SiGe BiCMOS technologies.
Specialty foundry technologies can provide an exceptional platform for developing semiconductor solutions across a broad range of applications, from the mobile infrastructure to power management to smartphones and the myriad of everyday devices that are being transformed into smarter products. With extensive design experience, rigorous modeling capabilities, advanced manufacturing facilities and unmatched support from IBM, you can move from concept to design to production faster than ever.
Prototyping and low volume production
The IBM Multi-Project Wafer (MPW) program is designed to help small, innovative organizations design and prototype high-performance chips at a lower cost. MPWs help keep the cost of fabricating prototype and low-volume quantities low by aggregating multiple designs on to a single wafer, which enables multiple customers to share production overhead costs.
Regularly scheduled MPWs using IBM’s technologies are available through MOSIS, an IBM Business Partner. View the latest MPW schedule (link resides outside of ibm.com).
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