It's time to differentiate your silicon
IBM microelectronics delivers application-optimized semiconductor technologies designed to take performance, integration and power efficiency to the next level in solutions spanning mobile and wired, from consumer products to the cloud. With technologies that benefit from cutting-edge collaborative semiconductor R&D and a silicon portfolio tuned to tackle the challenges and opportunities created by more users, more connectivity and more data, IBM can help you differentiate your silicon.
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Registerto watch keynote addresses from the Common Platform Technology Forum, available on demand through 2013.
Dr. Gary Patton, Vice President of the IBM Semiconductor R&D Center, discusses the advantages of collaboration in next-gen technologies, including 14 nm FinFET, with Cadence and ARM executives in a panel interview moderated by ChipEstimate.
Joe Abler, IBM Program Manager for Common Platform Ecosystem Enablement, discusses alliance focus technologies, including FinFET.