It's time to differentiate your silicon
IBM microelectronics delivers application-optimized semiconductor technologies designed to take performance, integration and power efficiency to the next level in solutions spanning mobile and wired, from consumer products to the cloud. With technologies that benefit from cutting-edge collaborative semiconductor R&D and a silicon portfolio tuned to tackle the challenges and opportunities created by more users, more connectivity and more data, IBM can help you differentiate your silicon.
IBM Cu-32
Design chips to move data across the network and into the cloud faster with the Cu-32 custom logic design system.
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Semiconductor innovation
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In the news
- IBM extends 7RF SOI PDK support to include Agilent Technologies’ Advanced Design System Software
- IBM Preps New Wireless Chip Technology to Allow Mobile Operators to Clear the Data Bottleneck
- UAlbany NanoCollege expands its world-class research capabilities through membership in the IBM prestigious Joint Development Alliance (resides outside of ibm.com)
Common Platform Technology Forum 2013
Registerto watch keynote addresses from the Common Platform Technology Forum, available on demand through 2013.
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The power of collaboration in next-gen technologies (00:07:12)
Dr. Gary Patton, Vice President of the IBM Semiconductor R&D Center, discusses the advantages of collaboration in next-gen technologies, including 14 nm FinFET, with Cadence and ARM executives in a panel interview moderated by ChipEstimate.
Common Platform technology focus areas (00:03:49)
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Joe Abler, IBM Program Manager for Common Platform Ecosystem Enablement, discusses alliance focus technologies, including FinFET.