It’s time to differentiate your silicon
To help build a Smarter Planet businesses need to gather, analyze and draw insights from large amounts of data accumulated from an instrumented, interconnected world. From mobile phones to utility meters to artificial hearts, today’s products are smarter. As the planet relies more and more on these intelligent, interconnected devices, their performance, reliability and efficiency become paramount.
IBM semiconductor technology is at the heart of countless numbers of these devices, providing the billions of transistors embedded in products big and small that make goods—and their users—more digitally aware and interconnected.
Process technology
IBM and our strategic alliance of semiconductor manufacturing, development and technology companies have a firm and ongoing commitment to advanced semiconductor technology leadership. Working together, we continue to address key product design and advanced process development challenges to produce a smaller, faster, more cost efficient generation of semiconductors.
Learn more about process technology
SOI for smarter products
IBM’s silicon-on-insulator (SOI) technology can provide significantly higher chip performance improvement and extraordinary power reduction compared to standard bulk silicon technology. This technology helps improve the performance and efficiency of products ranging from servers to game consoles. The Ready for SOI program is making available the building blocks necessary for chip designers to take advantage of the benefits of SOI technology for new applications, including mobile internet devices and consumer products.
Learn more about SOI for smarter products
Specialty foundry
IBM specialty foundry technologies are helping to transform “ordinary” products into smarter, interconnected devices. With extensive design experience, rigorous modeling capabilities, advanced manufacturing facilities and unmatched support from IBM, you can move from concept to design to production faster than ever.
What we offer
We offer a full range of semiconductor technologies, products and services.
Announcements
- WiSpry and IBM Collaborate to Develop Next-Generation of Tunable Mobile Terminal Front-End Technology (link resides outside of IBM.com)
- IBM, Samsung and GLOBALFOUNDRIES Set for Fab Synchronization to Produce Advanced Chips Based on 28nm Process Technology with STMicroelectronics (link resides outside of IBM.com)
- Infineon Announces Production of Security Chips in U.S. Foundry; IBM Burlington Plant Qualified to Supply Security Chips for Secure Government ID Programs (link resides outside of IBM.com)
- A 32/28nm HKMG Vertically Optimized Design Platform announcement w/ARM, Samsung, GLOBALFOUNDRIES and Synopsys
- Linaro unites industry leaders to foster innovation in the Linux® community through a common foundation of tools and software (link resides outside of IBM.com)
- More
