It's time to differentiate your silicon
IBM microelectronics delivers application-optimized semiconductor technologies designed to take performance, integration and power efficiency to the next level in solutions spanning mobile and wired, from consumer products to the cloud. With technologies that benefit from cutting-edge collaborative semiconductor R&D and a silicon portfolio tuned to tackle the challenges and opportunities created by more users, more connectivity and more data, IBM can help you differentiate your silicon.
Custom logic memory innovations
See how embedded memory innovations from IBM are keeping big data on the move.
SiGe 8HP
Find out more about IBM SiGe 8HP, a performance-optimized technology for the most demanding RF applications.
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In the news
- UAlbany NanoCollege expands its world-class research capabilities through membership in the IBM prestigious Joint Development Alliance (resides outside of ibm.com)
- Kilopass XPM IP Provides Non Volatile Memory in IBM 65nm LPE Process For Portable Devices That Demand Lower Leakage Than Bulk CMOS Provides (link resides outside ibm.com)
- Cadence Announces Tapeout of 14nm Test-chip with ARM Processor and IBM FinFET Process Technology
Common Platform Technology Forum 2013
Registerto watch keynote addresses from the Common Platform Technology Forum, available on demand through 2013.
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The power of collaboration in next-gen technologies (00:07:12)
Dr. Gary Patton, Vice President of the IBM Semiconductor R&D Center, discusses the advantages of collaboration in next-gen technologies, including 14 nm FinFET, with Cadence and ARM executives in a panel interview moderated by ChipEstimate.
Common Platform technology focus areas (00:03:49)
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Joe Abler, IBM Program Manager for Common Platform Ecosystem Enablement, discusses alliance focus technologies, including FinFET.