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IBM System z10 Enterprise Class

  
Overview Features & benefits Specifications

Benefit Feature/Function
Availability/Reliability
  • CICS subspace group facility

  • CICS subsystem storage protect

  • Concurrent Book Add

  • Concurrent ESCON, FICON, OSA-E and Coupling Link maintenance

  • Concurrent Hardware Management Console (HMC) and Support Element

  • Concurrent Licensed Internal Code (LIC) maintenance for CP, SAP, SE, PR/SM™, LPAR, HMC, OSA-E

  • Concurrent power and thermal maintenance

  • Dual Support Elements

  • Dynamic Change to Partition Cryptographic Coprocessor Configuration

  • Dynamic Channel Path Management

  • Dynamic I/O Reconfiguration

  • Dynamic memory sparing

  • Dynamic Oscillator Switchover

  • Dynamic LCSS Add

  • Dynamic Subchannel Set Add

  • Dynamic Partition Add

  • Enhanced Application Preservation

  • Enhanced Book Availability

  • Enhanced Driver Maintenance

  • Enhanced Dynamic Reconfiguration Management

  • Enhanced Firmware Simulation

  • Failure Containment for MBA

  • Fault Tolerant Interconnect Design

  • FICON Purge Path Extended

  • FICON Express4 Pluggable Optics for individual servicing

  • Fixed HSA

  • Frame Bolt Down Feature

  • Hybrid cooling

  • Multipath IPL—ESCON (CNC), FICON (FC) with z/OS

  • N+1 power supply technology

  • OSA-Express2 Link Aggregation Support

  • OSA-Express2 Network Traffic Analyzer

  • Partial memory restart

  • Point to Point SMP Fabric

  • QDIO Diagnostic Synchronization

  • Redundant I/O Interconnect

  • Remote operations support

  • Sparing for Storage Protect Preservation Keys

  • System Assist Processor (SAP) reassignment and sparing

  • System-Initiated CHPID Reconfiguration

  • Transparent CP Sparing
Security
  • Advanced encryption standard (AES) 128, 192, 256

  • Certified for LPAR isolation

  • Configurable Crypto Express2 (secure coprocessor or SSL acceleration)

  • CP Assist for Cryptographic Function

  • Crypto Express2 FIPS 140-2 Level 4 Certified

  • Data Encryption Standards (DES), Triple DES

  • Designed to meet Common Criteria Evaluation Assurance Level 5 (EAL5) certification for the security of its logical partitions

  • LDAP support for HMC user authentication

  • Open Architecture Distributed Transaction Enablement

  • Pseudo random number generator (PRNG)

  • Remote key load for ATMs

  • Secure hash algorithm-256 (SHA-256), -384, -512

  • SSL Acceleration for Linux® and z/OS

  • Tamper-proof Cryptographic Support
Capacity on Demand
  • API for Capacity Provisioning Management

  • API for On/Off CoD activation

  • Capacity Backup for both full and subcapacity CPs

  • Capacity Backup for zAAP, zIIP, IFL, ICF and SAP

  • Capacity for Planned Event (CPE)

  • Capacity Upgrade on Demand

  • Customer Initiated upgrades

  • On/Off Capacity on Demand

  • More than 200 configuration records may be staged on Support Element

  • Up to four active configurations stored on SEEPROM
Specialty Engines
  • Integrated Facility for Linux (IFL)

  • Internal Coupling Facility (ICF)

  • System z10 Application Assist Processor (zAAP)

  • System z10 Integrated Information Processor (zIIP)
I/O Connectivity
  • InfiniBand® (IFB) host bus (6 GBps each); 24 IFBs for I/O HCA2-C Fanout

  • IBM ESCON CTC native and basic mode

  • FCP support for SCSI devices by Linux, z/VM® and z/VSE (disks)

  • Fibre Connection (FICON) 1, 2, 4, Gbps auto-negotiation

  • Fibre Channel Protocol (FCP) 1, 2, 4 Gbps auto-negotiation

  • FICON CTC

  • FICON full duplex data transfer

  • Full fabric FCP support

  • IBM ESCON half duplex data transfer

  • Multiple Image Facility (MIF)

  • Multiple Subchannel Sets (MSS)

  • N_Port ID virtualization (NPIV) for FCP

  • QDIO designed for high speed networking

  • Up to four Logical Channel SubSystems (LCSS)
Networking
  • IBM HiperSockets IPv6

  • OSA for NCP (OSN)

  • OSA Layer 3 VMAC

  • OSA-Express2 Layer 2 Support

  • OSA-Express Integrated Console Controller (1000BASE-T Ethernet)

  • OSA-Express2 (Gigabit Ethernet, 10 Gigabit Ethernet, 1000BASE-T Ethernet)

  • OSA-Express3 (10 Gigabit Ethernet) 5
Cluster Systems
  • Dynamic CF Dispatching

  • Dynamic ICF Expansion

  • Shared ICFs and CPs

  • Transparent ICF sparing

  • System-Managed CF Structured Duplexing

  • Sysplex Distributor

  • GDPS

  • Parallel Sysplex® clustering technology

  • 12x IB-DDR (6 GBps)

  • InfiniBand Coupling links 5

  • Internal Coupling channel (IC)

  • Integrated Cluster Bus-4 (ICB-4)

  • InterSystem Channel-3 (Peer mode only) (ISC-3)

  • MBA and HCA-O Fanout

  • ETR–Sysplex Timer attachment (standard)

  • Server Time Protocol (STP)

  • NTP Client support for STP

  • z/VM Virtual Parallel Sysplex
Performance
  • Compare-and-move extended

  • DB2® sort assist

  • Flexible Memory Options

  • Hardware-assisted data compression

  • Hardware Decimal Floating Point

  • HiperDispatch

  • Hipersorting

  • IBM Hiperbatch™

  • IEEE binary floating point support for advanced IBM Lotus® Domino® and Java™ performance

  • Long Displacement Facility

  • Modified Indirect Data Address Word (MIDAW) Facility

  • OSA Dynamic LAN idle

  • Performed Locked Operations for enhanced IP performance

  • Up to 1.5 TB memory
Management
  • (SE) maintenance

  • HMC Panel Wizard

  • HMC and SE IPv6 Support

  • Internal Battery Feature

  • Power/thermal

  • IBM Systems Director Active Energy Manager (AEM) for Linux on System z Support

  • LPAR Group Capacity Limits

  • ESCON sparing

  • Cancel I/O Requests

  • Power Monitoring Display

  • Power Estimation tool
z/Architecture
  • Intelligent Resource Director

  • Superscalar Processor

  • Tri-modal addressability

  • Up to 60 LPARs each with 64-bit central memory addressability



 
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