IBM System x iDataPlex dx360 M3

Highlights

• Award-winning design optimizing efficiencies in energy, cooling and density for data centers
• Operational costs drastically reduced based on innovative shallow depth server form factor
• High performance computing embracing broad, flexible portfolio of offerings with simplified system management and tools.

Designed for data centers that require high performance, yet are constrained on floor space, power and cooling infrastructure, the IBM System x® iDataPlex® dx360 M3 provides an innovative, half-depth solution optimized for maximum density and incredible efficiency. Featuring the latest Intel® Xeon® Processor 5600 series with 16 DDR-3 DIMM sockets and two PCIe x16 Gen 2 slots, the dx360 M3 is easy to manage and delivers outstanding performance in a flexible platform that can be tailored to your data center’s processing, storage or I/O needs.

For high performance computing, the dx360 M3 allows you to pack accelerated processing into the same power and cooling envelope as traditional servers, better utilizing floor space and optimizing the data center. The flexible design of the dx360 M3 integrates the right compute, storage or I/O capabilities required in your data center while optimizing density.

The innovative, shallow-depth form factor of the dx360 M3 reduces the airflow required across the components, lowering the power needed for cooling. High-efficiency power supplies, larger, better-optimized fans in the 2U chassis, and power management capabilities provide further efficiencies to minimize the dx360 M3’s power requirements.

The dx360 M3 is simple to manage on a server level or at a rack level as part of an iDataPlex rack. IBM ToolsCenter provides common management across all System x servers, making the dx360 M3 easy to incorporate into your data center.