Who is IBM Assembly and Test Services?

Advanced, customized packaging products and services for performance advantages and rapid time-to-market

Getting the most from a semiconductor design today means finding inventive ways to maximize performance beyond silicon scaling alone. The right packaging solution matters more than ever.

With extensive experience in bringing both complex and high-volume packaging solutions to the marketplace, the IBM assembly and test services offerings are designed to help customers quickly ramp sophisticated solutions to production volumes.

Our Services

Advanced IBM flip-chip package

IBM offers a comprehensive portfolio of leading-edge package assembly and test services optimized to deliver differentiation and performance. We specialize in both large area and high-complexity packaging. We offer turnkey analysis from material characterization and predictive design to rapid prototyping and efficient scale-up to high volume manufacturing. Our mindset is one of quality, precision, and technical leadership while facilitating fast turn-around-time for both development and production. We support semiconductor fabless, integrated device manufacturers (IDMs), as well as original equipment manufacturers (OEMs).

Semiconductor test services

From chip design through production, IBM’s comprehensive Test Service provides the customer with optimized approaches to test strategy, methodology, and final test plans. Best known methods for implementing Design for Test (DFT) and Design for Manufacturing (DFM) promote process flow efficiencies, high productivity and accelerated time-to-market. Creating customized test solutions from prototype to final product characterization is standard practice. Digital, analog, mixed signal, RF and optoelectronic testing as well as burn-in services are available.

Mechanical, electrical, and thermal modeling/simulation

Modelling, simulation and predictive tools employ IBM proprietary algorithms, codes, and our library of extensive materials properties and manufacturing tolerances – defined through the manufacturer and supplemented through measurement, analysis and field application.  Collectively, the data and our deep experience provide excellent model-to-hardware correlation.  Package and system level signal and power integrity are emphasized. Broad based analysis includes active and passive components, package, socket, PCB, connectors, and cabling to contribute to a first-time-right design.

Additional Opportunities

Analytical services, reliabiity and failure analysis

Analytical services, reliabiity and failure analysis

IBM laboratory services showcase technical know-how derived from decades of experience supporting development and manufacturing of high value products. First-time-right package design begins with material characterization and package modelling.

MiQro Innovation Collaborative Center (C2MI)

MiQro Innovation Collaborative Center (C2MI)

C2MI facilitate microsystem design and prototyping in compliance with market needs in fields of application such as communication technology, automobile, aerospace, environment and health, so as accelerate commercialization.

IBM Research on Silicon Nanophotonic Packaging

IBM Research on Silicon Nanophotonic Packaging

Questions? Contact us at assembly@ca.ibm.com