Who is IBM Assembly and Test Services?
Advanced, customized packaging products and services for performance advantages and rapid time-to-market
Getting the most from a semiconductor design today means finding inventive ways to maximize performance beyond silicon scaling alone. The right packaging solution matters more than ever.
Advanced packaging solutions
IBM offers a comprehensive portfolio of leading-edge package assembly and test services optimized to deliver differentiation and performance. We specialize in both large area and high-complexity packaging. We offer turnkey analysis from material characterization and predictive design to rapid prototyping and efficient scale-up to high volume manufacturing. Our mindset is one of quality, precision, and technical leadership while facilitating fast turn-around-time for both development and production. We support semiconductor fabless, integrated device manufacturers (IDMs), as well as original equipment manufacturers (OEMs).
Semiconductor test services
From chip design through production, IBM’s comprehensive Test Service provides the customer with optimized approaches to test strategy, methodology, and final test plans. Best known methods for implementing Design for Test (DFT) and Design for Manufacturing (DFM) promote process flow efficiencies, high productivity and accelerated time-to-market. Creating customized test solutions from prototype to final product characterization is standard practice. Digital, analog, mixed signal, RF and optoelectronic testing as well as burn-in services are available.
Mechanical, electrical, and thermal modeling/simulation
Modelling, simulation and predictive tools employ IBM proprietary algorithms, codes, and our library of extensive materials properties and manufacturing tolerances – defined through the manufacturer and supplemented through measurement, analysis and field application. Collectively, the data and our deep experience provide excellent model-to-hardware correlation. Package and system level signal and power integrity are emphasized. Broad based analysis includes active and passive components, package, socket, PCB, connectors, and cabling to contribute to a first-time-right design.