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Feature |
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Benefits |
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| Distinctive dual-core 2.2 GHz POWER5+ module with only a single core active (8-core node) |
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- Twice the per processor cache (36MB) of other IBM POWER5 systems delivers better performance potential for memory bandwidth-intensive applications
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| High-density dual-core 1.9 GHz POWER5+ module (16-core node) |
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- Twice the packaging density of the 8-core node
- Up to 60% greater floating-point performance than the 8-core node
- Improved price/performance
- Up to 192 CPUs in a single 24-inch rack
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| High memory / I/O bandwidth |
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- Fast processors wait less for data to be moved through the system
- Delivers data faster for the needs of HPC and other memory bandwidth-intensive applications
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| Modular 2U packaging |
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- Higher packaging density requires less floor space than less densely packaged systems
- Only four replaceable modules simplify maintenance procedures and improve system serviceability
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| Distinctive power distribution module |
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- Embedded circuitry replaces external wiring for more reliable and efficient power distribution
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| Rear Door Heat eXchanger Kit |
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- Highly efficient cooling system significantly reduces energy requirements
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| Shared processor pool* |
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- Provides the ability to transparently share processing power between partitions
- Helps balance processing power and helps make sure the high priority partitions get the processor cycles they need
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| Micro-Partitioning* |
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- Allows each processor in the shared processor pool to be split into as many as 10 partitions
- Fine tune processing power to match workloads
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| Virtual I/O* |
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- Helps save cost and ease systems administration by sharing expensive resources
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| Virtual LAN* |
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- Helps speed internal communication between partitions at memory speeds
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| Dynamic logical partitioning* |
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- Allows reallocation of system resources without rebooting affected partitions
- Offers greater flexibility in using available capacity and more rapidly matching resources to changing business requirements
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| Mainframe-inspired RAS features |
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- Delivers exceptional system availability using features usually found on much larger, more expensive systems including service processor, IBM Chipkill™ memory, First Failure Data Capture, dynamic deallocation of selected system resources, hot-plug PCI-X slots, hot-swappable disk bays, hot-add I/O drawer, dynamic firmware updates and more
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| Scale-out with CSM support* |
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- Allows for more granular growth so end-user demands can be readily satisfied
- Provides centralized management of multiple interconnected systems
- Provides ability to handle unexpected workload peaks by sharing resources
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| High Performance Switch attachment* |
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- Designed to offer maximum performance, scalability and throughput for parallel message-passing applications
- Allows attachment of up to 128 cluster nodes
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| Multiple operating system support |
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- Allows clients the flexibility to select the right operating system and the right application to meet their needs
- Provides the ability to expand applications choices to include many open source applications
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| AIX 5L operating system* |
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- Designed to deliver increased throughput for mixed workloads without complex system configuration or tuning
- Delivers integrated security features designed for system protection
- Extends application choices with Linux affinity
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| Linux operating system* |
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- Enables access 32- and 64-bit open source applications
- Provides a common operating environment across IBM server platforms
- Built on open standards
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