|
Attribute
|
Description
|
Benefit
|
| Processor |
PowerPC 440 700 MHz; two per node |
Low power allows dense packaging; better processor-memory balance |
| Memory per node |
512MB SDRAM-DDR (Model 0203-700)
1 GB SDRAM-DDR (Model 0203-900)
|
|
| Networks |
1) 3D Torus - 175 MB/sec in each direction
2) Collective Network-350 MB/sec; 1.5 µsec latency
3) Global Barrier/Interrupt
4) Gigabit Ethernet (I/O & connectivity)
5) Control (system boot, debug, monitoring)
|
Special networks speed up internode communications; designed for MPI programming constructs; improve systems management |
| Computer nodes |
Dual processor; 1024 per rack |
Double FPU improves performance |
| I/O nodes |
Dual processor; 16-128 per rack |
Facilitates job launch and I/O, raising efficiency of compute nodes |
| Operating Systems |
Compute Node—Lightweight proprietary kernel
I/O Node—Embedded Linux
Front End and Service Nodes—SUSE SLES 9 Linux
|
Kernel tailored to processor design; industry-standard distribution on front-end and service nodes preserves familiarity to end users and administrators |
| Performance |
Peak performance per rack—5.73 teraflops
Linpack performance per rack—4.71 teraflops
|
Highest available performance
benefits capability customers
|
| Power |
27.6 kW power consumption per rack (maximum)
7 kW power consumption per rack (idle)
208 VAC 3-phase; 100 amp service per rack
|
Low power draw enables dense packaging |
| Cooling |
Air conditioning 8 tons/rack (minimum)
2800 CFM (compute rack); 350 CFM (power supplies)
|
Low cooling requirements enable extreme scale-up |
| Acoustics |
9.0 LwAD and 8.7 LwAm |
|
Dimensions
(include air duct)
|
Height—77"
Width—36"
Depth—36"
Weight—1810 lbs
Service clearances—30" front and back
Raised floor height—16" minimum
|
Design allows dense floor plan layout for better floor space utilization |
