| Availability/Reliability |
- CICS subspace group facility
- CICS subsystem storage protect
- Concurrent Book Add
- Concurrent ESCON, FICON, OSA-E and Coupling Link maintenance
- Concurrent Hardware Management Console (HMC) and Support Element
- Concurrent Licensed Internal Code (LIC) maintenance for CP, SAP, SE, PR/SM, LPAR, HMC and OSA-E
- Concurrent power and thermal maintenance
- Dual Support Elements
- Dynamic Change to Partition Cryptographic Coprocessor Configuration
- Dynamic Channel Path Management
- Dynamic I/O Reconfiguration
- Dynamic memory sparing
- Dynamic Oscillator Switchover
- Dynamic Logical Channel SubSystems (LCSS) Add
- Dynamic Subchannel Set Add
- Dynamic Partition Add
- Dynamic PU reassignment
- Enhanced Application Preservation
- Enhanced Book Availability
- Enhanced Driver Maintenance
- Enhanced Dynamic Reconfiguration Management
- Enhanced Firmware Simulation
- Failure Containment for MBA
- Fault Tolerant Interconnect Design
- FICON Purge Path Extended
- FICON Express8 and FICON Express4 Pluggable Optics for individual servicing
- Fixed HSA
- Frame Bolt Down Feature
- Hybrid cooling
- Internal Battery Feature
- Multipath IPL – ESCON (CNC), FICON (FC) with z/OS
- N+1 power supply technology
- OSA-Express3 and OSA-Express2 Link Aggregation Support
- OSA-Express3 and OSA-Express2 Network Traffic Analyser
- Partial memory restart
- Plan ahead memory
- Point to Point SMP Fabric
- QDIO Diagnostic Synchronisation
- Redundant I/O Interconnect
- Remote operations support
- Sparing for Storage Protect Preservation Keys
- SAP reassignment and sparing
- System-Initiated CHPID Reconfiguration
- Transparent CP Sparing
|
| Security |
- AES 128, 192, 256
- Certified for LPAR isolation
- Configurable Crypto Express3 and Crypto Express2 (secure coprocessor or SSL acceleration)
- OSA Express3/2 support for QDIO connection isolation
- CP Assist for Cryptographic Function with new Protected Key capability
- DES, Triple DES
- Common Criteria EAL5 certified for the security of its LPARs
- Lightweight Directory Access Protocol (LDAP) support for HMC user authentication
- Open Architecture Distributed Transaction Enablement
- PRNG
- Remote key load for ATMs
- SHA1, SHA-224, SHA-256, SHA-384, SHA-512
- Support for up to 19 digit Personal Account Numbers
- SSL Acceleration for Linux for System z and z/OS
- Tamper-detecting and responding cryptographic hardware
|
| Capacity on Demand (CoD) |
- API for Capacity Provisioning Management
- API for On/Off CoD activation
- Capacity Backup for both full and subcapacity CPs
- Capacity Backup for zAAP, zIIP, IFL, ICF and SAP
- CPE
- Capacity Tokens for On/Off CoD
- CUoD
- Customer Initiated upgrades
- On/Off CoD
- More than 200 configuration records may be staged on Support Element
- Up to eight active configurations stored on SEEPROM
|
| Specialty Engines |
|
| I/O Connectivity |
- InfiniBand (IFB) host bus; 24 IFBs for I/O HCA2-C Fanout
- IBM ESCON CTC native and basic mode
- FCP support for SCSI devices by Linux, z/VM and z/VSE (disks)
- Fibre Connection (FICON, zHPF) 1, 2, 4, 8 Gigabits per second (Gbps)
- FCP 1, 2, 4, 8 Gbps
- FICON Express8 auto-negotiation for 2, 4, 8 Gbps
- FICON Express4 auto-negotiation for 1, 2, 4 Gbps
- FICON CTC
- FICON full duplex data transfer
- Full fabric FCP support
- IBM ESCON half duplex data transfer
- Multiple Image Facility (MIF)
- Multiple Subchannel Sets (MSS)
- N_Port ID virtualisation (NPIV) for FCP
- QDIO designed for high-speed networking
- Up to four LCSS
|
| Networking |
- IBM HiperSockets IPv6
- OSA for NCP (OSN)
- OSA Layer 3 VMAC
- OSA-Express3, OSA-Express2 Layer 2 Support
- OSA-Express Integrated Console Controller (1000BASE-T Ethernet) – dual or multiport
- OSA-Express2 (Gigabit Ethernet (GbE), 10 GbE, 1000BASE-T Ethernet)
- OSA-Express3 (Gigabit, 10 GbE, 1000BASE-T Ethernet)
|
| Cluster Systems |
- CFCC Level 16
- Dynamic CF Dispatching
- ETR – Sysplex Timer attachment (standard)
- GDPS
- InfiniBand Coupling links
- Internal Coupling channel (IC)
- Integrated Cluster Bus-4 (ICB-4)
- InterSystem Channel-3 (Peer mode only) (ISC-3)
- MBA and HCA-O Fanout
- NTP Client support for STP
- NTP Server for STP
- Parallel Sysplex clustering technology
- STP
- Shared ICFs and CPs
- System-Managed CF Structured Duplexing
- Transparent ICF Sharing
- z/VM Virtual Parallel Sysplex
|
| Performance |
- Compare-and-move extended
- DB2 sort assist
- Flexible Memory Options
- Hardware-assisted data compression
- Hardware Decimal Floating Point
- HiperDispatch
- Hipersorting
- zHPF
- IBM Hiperbatch
- IEEE binary floating point support for advanced IBM Lotus Domino and Java performance
- Long Displacement Facility
- Modified Indirect Data Address Word (MIDAW) Facility
- OSA Dynamic LAN idle
- Performed Locked Operations for enhanced IP performance
- Up to 1.5 TB memory
|
| Management |
- Balanced Power Plan Ahead
- (SE) maintenance
- HiperSockets Network Traffic Analyser (NTA)
- HMC Panel Wizard
- HMC and SE IPv6 Support
- IBM Systems Director Active Energy Manager for Linux on System z Support
- LPAR Group Capacity Limits
- Cancel I/O Requests
- Power Monitoring Display
- Power Estimation tool
|
| z/Architecture |
- Intelligent Resource Director
- System z10 Processor Chip
- Superscalar Processor
- Tri-modal addressability
- Up to 60 LPARs each with 64-bit central memory addressability
|
