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Topic: Microelectronics [remove], [remove all]
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ASICs, Other (buildings, other chips etc), Power Architecture
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Scientists Discover New Atomic Technique to Charge Memory Chips
Date added: 2013-03-22
Optical image of a typical ionic liquid (IL) gated device with a droplet of IL on top of the gate electrode and the oxide channel. The gold squares are pads used to make contact to the device via wire-bonding. On right is the magnified image of the device showing the channel (brownish yellow) and the gold electrical contacts (bright yellow). The contacts on the right and left of the channel are the source and drain contacts. The four other contact are used for 4-wire resistance & Hall measurements. (Credit: IBM)
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IBM carbon nanotubes in solution
Date added: 2012-10-28
IBM researcher Hongsik Park observes different solutions of carbon nanotubes. Carbon nanotubes, borne out of chemistry, have largely been laboratory curiosities as far as microelectronic applications are concerned. Carbon nanotubes naturally come as a mix of metallic and semiconducting species and need to be placed perfectly on the wafer surface to make electronic circuits. For device operation, only the semiconducting kind of tubes is useful which requires essentially complete removal of the metallic ones to prevent errors in circuits. (Credit: IBM)
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IBM SEM of carbon nanotube substrate
Date added: 2012-10-28
IBM SEM image of carbon nanotubes deposited on a trench coated in hafnium oxide (HfO2) showing extremely high density and excellent selectivity (scale bar: 2 μm). Credit: IBM
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New POWER7+ microprocessor
Date added: 2012-10-03
Among its many features, the new POWER7+ microprocessor offers an expanded 2.5x L3 cache memory, greater security with faster file encryption for the IBM AIX operating system, and memory compression that results in no increased energy usage over previous generation POWER7 chips. (Credit: IBM)
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IBM to Produce Micron's Hybrid Memory Cube in Debut of First Commercial, 3D Chip-Making Capability
Date added: 2011-12-01
Micron's Hybrid Memory Cube features a stack of individual chips connected by vertical pipelines or “vias,” shown above. IBM’s new 3-D manufacturing technology, used to connect the 3D micro structure, will be the foundation for commercial production of the new memory cube.
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