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Topic: Microelectronics [remove], [remove all]
There are 104 results. (see area below)
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Subtopics
ASICs, Other (buildings, other chips etc), Power Architecture
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3M and IBM to Develop New Types of Adhesives to Create 3D Semiconductors
Date added: 2011-09-07
IBM and 3M Corp. are developing a new type of electronic “glue” that can be used to build stacks of semiconductors – 3D chips. The glue, shown in blue above, connects up to 100 separate chips as it conducts heat away from the silicon package. The innovation will create microprocessors 1,000 times more powerful than today’s PC chips.
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IBM and Jeopardy! Relive History with Encore Presentation of Jeopardy!: The IBM Challenge
Date added: 2011-08-30
IBM's Watson computer system, powered by IBM POWER7, competes against Jeopardy!'s two most successful and celebrated contestants -- Ken Jennings and Brad Rutter. Jeopardy! will broadcast an encore presentation of the first-ever man vs. machine Jeopardy! competition airing on September 12, 13 and 14, 2011.
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IBM's John Kelly Introduces the Watson Computer System at a News Conference
Date added: 2011-08-30
John E. Kelly III, IBM Senior Vice President and Director of IBM Research introduces IBM's Watson computer system to the media during a press conference at IBM's Watson Research Center in Yorktown Heights, NY on January 13, 2011. Watson competed against Jeopardy!'s two most successful and celebrated contestants -- Ken Jennings and Brad Rutter -- in the first-ever man vs. machine Jeopardy! competition, which aired on February 14, 15 and 16, 2011, with two matches being played over three consecutive days. Jeopardy! will broadcast an encore presentation of the Jeopardy!: The IBM Challenge on September 12, 13 and 14, 2011.
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Graphene Integrated Circuit
Date added: 2011-06-10
Optical image of a completed graphene integrated circuit (IC) including contact pads.
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IBM Embedded Dynamic Random Access Memory
Date added: 2011-06-07
IBM's embedded dynamic random access memory (test chip shown here) will help deliver a thrilling new game experience to Nintendo fans. The new memory technology, a key element of the new Power microprocessor that IBM is building for the Nintendo Wii U console, can triple the amount of memory contained on a single chip, making for extreme game play.
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