IBM SEM of carbon nanotube substrate
Date added: 2012-10-28
IBM SEM image of carbon nanotubes deposited on a trench coated in hafnium oxide (HfO2) showing extremely high density and excellent selectivity (scale bar: 2 μm). Credit: IBM
New POWER7+ microprocessor
Date added: 2012-10-03
Among its many features, the new POWER7+ microprocessor offers an expanded 2.5x L3 cache memory, greater security with faster file encryption for the IBM AIX operating system, and memory compression that results in no increased energy usage over previous generation POWER7 chips. (Credit: IBM)
IBM to Produce Micron's Hybrid Memory Cube in Debut of First Commercial, 3D Chip-Making Capability
Date added: 2011-12-01
Micron's Hybrid Memory Cube features a stack of individual chips connected by vertical pipelines or “vias,” shown above. IBM’s new 3-D manufacturing technology, used to connect the 3D micro structure, will be the foundation for commercial production of the new memory cube.
3M and IBM to Develop New Types of Adhesives to Create 3D Semiconductors
Date added: 2011-09-07
IBM and 3M Corp. are developing a new type of electronic “glue” that can be used to build stacks of semiconductors – 3D chips. The glue, shown in blue above, connects up to 100 separate chips as it conducts heat away from the silicon package. The innovation will create microprocessors 1,000 times more powerful than today’s PC chips.
IBM and Jeopardy! Relive History with Encore Presentation of Jeopardy!: The IBM Challenge
Date added: 2011-08-30
IBM's Watson computer system, powered by IBM POWER7, competes against Jeopardy!'s two most successful and celebrated contestants -- Ken Jennings and Brad Rutter. Jeopardy! will broadcast an encore presentation of the first-ever man vs. machine Jeopardy! competition airing on September 12, 13 and 14, 2011.