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  • Fully integrated phased array IC

    IBM researchers debut high-frequency wireless chip fabricated using IBM SiGe BiCMOS technology.


    Date added: 2013-06-04


    Fully integrated phased array IC. 6.7mm X 6.7mm. Fabricated in IBM SiGe BiCMOS technology. The IC integrates 32 receive and 16 transmit elements with dual outputs to support 16 dual polarized antennas

     

     



  • Packaged view of the intergrated circuit

    IBM research scientists create expandable 64 antenna array chip for 94-GHz backhaul communication and imaging applications


    Date added: 2013-06-04


    Packaged view of the intergrated circuit. The above photo depicts the size of the millimeter wave chip. Each of the 64 diamond shaped objects is an antenna. The spacing of these antennas is exact and allows for additional chips to be aligned next to the above one and expand the array.

     

     



  • Scientists Discover New Atomic Technique to Charge Memory Chips

    Scientists Discover New Atomic Technique to Charge Memory Chips


    Date added: 2013-03-22


    Optical image of a typical ionic liquid (IL) gated device with a droplet of IL on top of the gate electrode and the oxide channel. The gold squares are pads used to make contact to the device via wire-bonding. On right is the magnified image of the device showing the channel (brownish yellow) and the gold electrical contacts (bright yellow). The contacts on the right and left of the channel are the source and drain contacts. The four other contact are used for 4-wire resistance & Hall measurements. (Credit: IBM)

     

     



  • IBM carbon nanotubes in solution

    IBM carbon nanotubes in solution


    Date added: 2012-10-28


    IBM researcher Hongsik Park observes different solutions of carbon nanotubes. Carbon nanotubes, borne out of chemistry, have largely been laboratory curiosities as far as microelectronic applications are concerned. Carbon nanotubes naturally come as a mix of metallic and semiconducting species and need to be placed perfectly on the wafer surface to make electronic circuits. For device operation, only the semiconducting kind of tubes is useful which requires essentially complete removal of the metallic ones to prevent errors in circuits. (Credit: IBM)

     

     




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