3M and IBM to Develop New Types of Adhesives to Create 3D Semiconductors
Date added: 07 Sep 2011
IBM and 3M Corp. are developing a new type of electronic “glue” that can be used to build stacks of semiconductors – 3D chips. The glue, shown in blue above, connects up to 100 separate chips as it conducts heat away from the silicon package. The innovation will create microprocessors 1,000 times more powerful than today’s PC chips.