Skip to main content

IBM EXTENDS MOORE'S LAW TO THE THIRD DIMENSION

  • 3-D integrated stacked chips

    IBM EXTENDS MOORE'S LAW TO THE THIRD DIMENSION

    Date added: 12 Apr 2007

    IBM EXTENDS MOORE'S LAW TO THE THIRD DIMENSION: An IBM scientist holds a thinned wafer of silicon computer circuits, which is ready for bonding to another circuit wafer, where IBM's advanced "through-silicon via" process will connect the wafers together by etching thousands of holes through each layer and filling them with metal to create 3-D integrated stacked chips. The IBM breakthrough can shorten wire lengths inside chips up to 1000 times and allow for hundreds more pathways for data to flow among different functions on a chip. This technique will extend Moore's Law beyond its expected limits, paving the way for a new breed of smaller, faster and lower power chips.