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		<title>IBM Press Releases - Electronics - UK</title>
		<link>http://www.ibm.com/press</link>
		<description>IBM Press Releases</description>
		<pubDate>Tue, 02 Apr 2013 09:59:44 GMT</pubDate>  
		<language>en</language>
		<copyright>Copyright (c) IBM Corporation 2001, 2007. All rights reserved. See http://www.ibm.com/legal/us/ for copyright and trademark information.</copyright>
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			<title>IBM Press room - Electronics</title>
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					<title>Made in IBM Labs: Scientists Discover New Atomic Technique to Charge Memory Chips</title>
					<link><![CDATA[http://www.ibm.com/press/uk/en/pressrelease/40765.wss]]></link>
					<description><![CDATA[
					 IBM (NYSE: IBM) today announced a materials science breakthrough at the atomic level that could pave the way for a new class of non-volatile memory and logic chips that would use less power than today’s silicon based devices. Rather than using conventional electrical means that operate today’s semiconducting devices, IBM’s scientists discovered a new way to operate chips using tiny ionic currents, which are streams of charged atoms that could mimic the event-driven way in which the human brain operates.
					
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					</description>
					<category>Electronics</category>
					<pubDate>Tue, 02 Apr 2013 09:59:44 GMT</pubDate>
					<source url="http://www.ibm.com/press/uk/en/index.wss">IBM Press room - Electronics</source>
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				<item>
					<title>Online Retailer LabelSneak Captures Consumer Attention with Unique Shopping Experience</title>
					<link><![CDATA[http://www.ibm.com/press/uk/en/pressrelease/40508.wss]]></link>
					<description><![CDATA[
					IBM (NYSE: IBM) today announced its collaboration with LabelSneak, a small online retailer of discounted designer men&#39;s wear, which is using IBM Smarter Commerce technologies to create a unique shopping experience aimed at the millennial consumer.  As a result, LabelSneak has seen 148 percent growth in revenue, tripling sales in less than one year. 
					
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					</description>
					<category>Electronics</category>
					<pubDate>Tue, 01 Jan 2013 07:10:29 GMT</pubDate>
					<source url="http://www.ibm.com/press/uk/en/index.wss">IBM Press room - Electronics</source>
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				<item>
					<title>Made in IBM Labs: Researchers Demonstrate Initial Steps toward Commercial Fabrication of Carbon Nanotubes as a Successor to Silicon</title>
					<link><![CDATA[http://www.ibm.com/press/uk/en/pressrelease/39322.wss]]></link>
					<description><![CDATA[
					IBM (NYSE: IBM) scientists have demonstrated a new approach to carbon nanotechnology that opens up the path for commercial fabrication of dramatically smaller, faster and more powerful computer chips. For the first time, more than ten thousand working transistors made of nano-sized tubes of carbon have been precisely placed and tested in a single chip using standard semiconductor processes. These carbon devices are poised to replace and outperform silicon technology allowing further miniaturization of computing components and leading the way for future microelectronics.
					
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					</description>
					<category>Electronics</category>
					<pubDate>Tue, 06 Nov 2012 02:22:11 GMT</pubDate>
					<source url="http://www.ibm.com/press/uk/en/index.wss">IBM Press room - Electronics</source>
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				<item>
					<title>IBM Unveils zEnterprise EC12, a Highly Secure System for Cloud Computing and Enterprise Data</title>
					<link><![CDATA[http://www.ibm.com/press/uk/en/pressrelease/38692.wss]]></link>
					<description><![CDATA[
					•New, cutting-edge System z® capabilities for security and analytics dramatically boost cloud performance with help from IBM Research innovations.
•	zEC12 offers 25% more performance per core, over 100 configurable cores and 50% more total capacity than its predecessor. 
•	The result of over $1 billion in IBM R&amp;D investment and collaborative client input on today&#39;s enterprise system challenges.

					
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					</description>
					<category>Electronics</category>
					<pubDate>Tue, 28 Aug 2012 01:54:11 GMT</pubDate>
					<source url="http://www.ibm.com/press/uk/en/index.wss">IBM Press room - Electronics</source>
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				<item>
					<title>Growth Markets Embracing IBM PureSystems to Help Ease IT Complexity and Skills Shortage</title>
					<link><![CDATA[http://www.ibm.com/press/uk/en/pressrelease/38529.wss]]></link>
					<description><![CDATA[
					As organizations around the world increasingly look for ways to reduce IT complexity and overcome the growing worldwide skills shortage, IBM (NYSE:IBM) today announced growing momentum of  IBM PureSystems among global clients and business partners.   In addition to education and technical guidance, IBM is also announcing new financing options as well as increased support from more than 700 of its Business Partners. 
					
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					</description>
					<category>Electronics</category>
					<pubDate>Thu, 02 Aug 2012 09:09:17 GMT</pubDate>
					<source url="http://www.ibm.com/press/uk/en/index.wss">IBM Press room - Electronics</source>
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				<item>
					<title>IBM Introduces New Class of Network Security Appliance to Control Social Media and Web Browsing Risks</title>
					<link><![CDATA[http://www.ibm.com/press/uk/en/pressrelease/38522.wss]]></link>
					<description><![CDATA[
					As employee access to the Web has become ubiquitous, enterprises are struggling with massive increases in malware as well as Advanced Persistent Threats (APTs), which can compromise proprietary data. Many of today&#39;s security solutions often offer limited visibility and control over network activity, putting the company at risk.
					
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					</description>
					<category>Electronics</category>
					<pubDate>Wed, 01 Aug 2012 08:46:55 GMT</pubDate>
					<source url="http://www.ibm.com/press/uk/en/index.wss">IBM Press room - Electronics</source>
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				<item>
					<title>3M and IBM to Develop New Types of Adhesives to Create 3D Semiconductors</title>
					<link><![CDATA[http://www.ibm.com/press/uk/en/pressrelease/35377.wss]]></link>
					<description><![CDATA[
					3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon “towers.” The companies are aiming to create a new class of materials, which will make it possible to build, for the first time, commercial microprocessors composed of layers of up to 100 separate chips. 
					
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					</description>
					<category>Electronics</category>
					<pubDate>Fri, 09 Sep 2011 08:32:39 GMT</pubDate>
					<source url="http://www.ibm.com/press/uk/en/index.wss">IBM Press room - Electronics</source>
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