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Scientists Discover New Atomic Technique to Charge Memory Chips
Date added: 2013-04-02
Optical image of a typical ionic liquid (IL) gated device with a droplet of IL on top of the gate electrode and the oxide channel. The gold squares are pads used to make contact to the device via wire-bonding. On right is the magnified image of the device showing the channel (brownish yellow) and the gold electrical contacts (bright yellow). The contacts on the right and left of the channel are the source and drain contacts. The four other contact are used for 4-wire resistance & Hall measurements. (Credit: IBM)
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20 Years of IBM Innovation
Date added: 2013-01-14
20 Years of IBM Innovation
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A Patent Milestone
Date added: 2013-01-14
IBM topped the U.S. patent list for the 20th consecutive year in 2012. The company's inventors received a record 6,478 patents in 2012 for a range of inventions that will enable advancements across key domains, such as analytics, Big Data, cybersecurity, cloud, mobile, and a new era of cognitive computing systems. IBM Master Inventor Stephen Bedell (pictured) shows a new class of flexible and versatile semiconductor materials enabled by U.S. Patent #8,247,261 that will power ultra-thin, lightweight and flexible products and can be applied to a wide range of technologies such as biomedical, security, wearable computing and solid-state lighting. (Credit: Jon Simon/Feature Photo Service for IBM)
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IBM to Produce Micron's Hybrid Memory Cube in Debut of First Commercial, 3D Chip-Making Capability
Date added: 2011-12-01
Micron's Hybrid Memory Cube features a stack of individual chips connected by vertical pipelines or “vias,” shown above. IBM’s new 3-D manufacturing technology, used to connect the 3D micro structure, will be the foundation for commercial production of the new memory cube.
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