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IBM researchers debut low-frequency wireless chip fabricated using IBM SiGe BiCMOS technology.

  • IBM researchers debut low-frequency wireless chip fabricated using IBM SiGe BiCMOS technology.

    IBM researchers debut low-frequency wireless chip fabricated using IBM SiGe BiCMOS technology.

    Date added: 04 Jun 2013

    Fully integrated phased array IC. 6.7mm X 6.7mm. Fabricated in IBM SiGe BiCMOS technology. The IC integrates 32 receive and 16 transmit elements with dual outputs to support 16 dual polarized antennas