1980

IBM introduces its innovative solution to heat dispersal for high performance computers, the award-winning Thermal Conduction Module.
IBM introduces its innovative solution to heat dispersal for high performance computers, the award-winning Thermal Conduction Module.

1983

1984

A field administration manager in Rockville, Md., in 1984.
A field administration manager in Rockville, Md., in 1984.

1985

1989