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Thermal Conduction Module

Thermal Conduction Module (TCM)

Thermal Conduction Module (TCM)
The IBM-developed TCM, used in large-scale IBM 3081 and other computers, was the industry's densest and most efficient logic packaging in the 1980s. One module could contain up to 132 circuit chips and had the processing power equivalent to that of a midrange System/370 computer of the 1970s. The water-cooled TCM had the shortest average chip-to-chip communication time of packaging in any general-purpose computer.