Associated enablement and IBM foundry services provide end–to–end solutions for the consumer electronics, networking, automotive, wireless communications, power management, media and entertainment, and aerospace and defense markets. Our offerings include bulk complementary metal–oxide–semiconductor (CMOS), low–power CMOS, RF CMOS, silicon-germanium (SiGe), high voltage, and silicon-on-insulator (SOI) technologies.
Analog and mixed–signal offerings — Our analog and mixed–signal (AMS) expertise is demonstrated by silicon-germanium market leadership and extends into RF CMOS for wireless communication. We can provide world-class enablement including models that precisely correlate to hardware, and a local and factory technical support structure that is critical for complex AMS design.
CMOS — IBM CMOS offerings, targeted for digital content in mobile devices and consumer electronics, provide access to IBM development in advanced technology nodes. We offer flexible business models that enable engagements from a base technology offering to an end-to-end foundry solution that utilize the extensive vendor network of IBM Business Partners. The Common Platform technology collaboration provides manufacturing choice and flexibility that can help meet your needs as your business grows from prototyping to high-volume mass production.
CMOS image sensors — The CMOS image sensor (CIMG) foundry offering targets consumer products and emerging applications by combining IBM's 180–nm and 130–nm copper process technology with 4T image sensor IP. Its features include an integrated design kit along with access to IBM's image sensor circuit library and vendor-acquired circuit IP.
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